Product Detail
TGV, Through Glass Via, is a vertical electrical interconnect across a glass substrate. Corresponding to TSV (Through Silicon Via), as a possible alternative material to silicon substrates is considered a key technology for next-generation 3D integration.
TGVs are made of high quality borosilicate glass, quartz glass as substrate, and are seed layer sputtered, electroplated filled, chemically and mechanically flattened, RDL rewired, and bump process leaded to achieve 3D interconnections.TGVs are microscopic via holes typically 10μm-100μm in diameter. For various applications in advanced packaging, tens of thousands of TGV vias are typically applied and metallised on each wafer to obtain the desired conductivity.
